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TDA4864J Datasheet(PDF) 7 Page - NXP Semiconductors

Part No. TDA4864J
Description  Vertical deflection booster
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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 7 page
background image
2003 Oct 31
7
Philips Semiconductors
Product specification
Vertical deflection booster
TDA4864J; TDA4864AJ
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to pin GND; unless
otherwise specified.
Notes
1. Internally limited by thermal protection; will be activated for Tj ≥ 150 °C.
2. Equivalent to discharging a 200 pF capacitor through a 0
Ω series resistor.
THERMAL CHARACTERISTICS
Note
1. To minimize the thermal resistance from mounting base to heatsink [Rth(mb-h)] follow the recommended mounting
instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases Rth(mb-h).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP1
supply voltage 1
40
V
VP2
supply voltage 2
60
V
VFB
flyback supply voltage of TDA4864J
60
V
VP3
flyback generator output voltage of TDA4864AJ
0
VP1 +3
V
Vi
input voltage on
pin INN
VP1
V
pin INP
VP1
V
Vo(V-OUT)
output voltage on pin V-OUT
62
V
IP2
supply current 2
−±1.5
A
Io(V-OUT)
output current on pin V-OUT
note 1
−±1.5
A
IVFB
current during flyback of TDA4864J
−±1.5
A
IVP3
current during flyback of TDA4864AJ
−±1.5
A
Tstg
storage temperature
−25
+150
°C
Tamb
ambient temperature
−20
+75
°C
Tj
junction temperature
note 1
150
°C
Ves
electrostatic discharge voltage on all pins
note 2
−300
+300
V
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-mb)
thermal resistance from junction to mounting base
note 1
6
K/W




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