SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

NOTE : Specifications subject to change without notice. Please check our website for latest information.

16.01.2014

8. SOLDERING AND MOUNTING :

8-1.2 Soldering Iron (Figure 2) :

8-1.1 Lead Free Solder Re-flow :

If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Mildly activated rosin fluxes are preferred. Our terminations are suitable for all wave and re-flow soldering systems.

Recommended temperature profiles for re-flow soldering in Figure 1.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a) Preheat circuit and products to 150° C.

b) 355° C tip temperature (max)

c) Never contact the ceramic with the iron tip

a soldering iron must be employed the following precautions are recommended.

Note :

8-1. Soldering

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4-5 secs.

d) 1.0mm tip diameter (max)

4 80s max.

60~180s

TP(260° C/40s max.)

Preheating

Figure 1. Re-flow Soldering : 3 times max.

150

25

217

200

Time(sec.)

G rad ual

Cooling

Over 1min.

Figure 2. Iron Soldering : 1 times max.

cooling

60~150s

20~40s

Soldering

Natural

cooling

150

350

Preheating

Soldering

Natural

within 4-5s

Time(sec.)

SMD Power Inductors

SPS252012E SERIES