MMUN2217L, NSVMMUN2217L

www.onsemi.com

2

Table 1. ORDERING INFORMATION

Device

Part Marking

Package

MMUN2217LT1G

AAM

SC−23

(Pb−Free)

3000 / Tape & Reel

NSVMMUN2217LT1G

AAM

SC−23

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

Figure 1. Derating Curve

AMBIENT TEMPERATURE (

°C)

125

100

75

50

25

0

−25

−50

0

50

100

150

200

250

300

150

(1)

(1) SOT−23; Minimum Pad

Table 2. THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

THERMAL CHARACTERISTICS (SOT−23) (MMUN2217L)

Total Device Dissipation

(Note 1)

(Note 2)

Derate above 25

°C

(Note 1)

(Note 2)

246

400

2.0

3.2

mW

mW/

°C

Thermal Resistance,

(Note 1)

Junction to Ambient

(Note 2)

508

311

°C/W

Thermal Resistance,

(Note 1)

Junction to Lead

(Note 2)

174

208

°C/W

Junction and Storage Temperature Range

−55 to +150

°C

1. FR−4 @ Minimum Pad.

2. FR−4 @ 1.0 x 1.0 Inch Pad.