Corcom Product Guide

LCT Series

250

LCT Series

Dimensions are in inches and millimeters unless otherwise specified. Values in italics

are metric equivalents. Dimensions are shown for reference purposes only.

Specifications subject to change.

Catalog: 1654001

Issue Date: 06.2011

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Low Capacitance Modular RJ Jacks

Specifications

• Low capacitance model for improved

performance.

• Particularly suited for ethernet applications

• Available with block or sleeve inductance

• Available with board grounded shield or

spring fingered panel ground interface

Available Part Numbers

UL Recognized

CSA Certified







     

     















   















RJ11-6LCT1-S

RJ45-8LCT1-S

RJ11-6LCT1-B

RJ45-8LCT1-B

RJ11-6LCT2-S

RJ45-8LCT2-S

RJ11-6LCT2-B

RJ45-8LCT2-B

Typical Insertion Loss





















     















   

















Performance Data

Model dimensions and PC board layout on pages 255-259

Shield 2

RJ11

Shield 1

RJ11

Shield 2

RJ45

Shield 1

RJ45

Contacts:

Material:

Phosphor Bronze

Plating:

50 microinches gold

Barrier underplating:

100 microinches nickel

Resistance:

Initial:

20 m

 max.

After 500 mating cycles:

30 m

 max.

Capacitors:

Type:

Monolithic ceramic chip

Standard Value:

82 pF

Standard Tolerance:

± 20%

Ferrites:

Type:

High resistivity, nickel zinc ceramic

Sleeves:

Single-aperture cylinders

Block:

Multi-aperture rectangular prism

Shield Material:

Tin-plated copper alloy

Housing Material:

Glass-filled polyester (UL94V-0)

Dielectric Withstanding Voltage:

Line to Line and Line to Ground:

1000 VAC for

60 seconds

Printed Circuit Board Retention:

Before soldering:

1 lb. minimum

After soldering:

20 lb. minimum