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MAX9993ETP-T Datasheet(PDF) 9 Page - Maxim Integrated Products |
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MAX9993ETP-T Datasheet(HTML) 9 Page - Maxim Integrated Products |
9 / 12 page High-Linearity Mixer The core of the MAX9993 is a double-balanced, high- performance passive mixer. Exceptional linearity is pro- vided by the large LO swing from the on-chip LO buffer; IIP3 is typically +23.5dBm, IIP2 is typically +60dBm, and total cascaded NF is 9.5dB. Differential IF Output Amplifier The MAX9993 mixer has an IF frequency range of 40MHz to 350MHz. The differential, open-collector IF output ports require external pullup inductors to VCC. Single-ended IF applications require a 4:1 balun to transform the 200 Ω differential output impedance to a 50 Ω single-ended out- put. After the balun, VSWR is typically 1.5:1. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50 Ω. No matching components are required. Return loss at the RF port is better than 15dB over the entire input range, 1700MHz to 2200MHz, and return loss at LO1 and LO2 is better than 10dB from 1400MHz to 2000MHz. RF and LO inputs require only DC-blocking capacitors for interfacing. These DC-blocking capaci- tors can be part of the matching circuit. The IF output impedance is 200 Ω differential out of the IC. An external low-loss 4:1 balun brings this imped- ance down to a 50 Ω single-ended output (see the Typical Application Circuit). Bias Resistors Bias currents for the LO buffer and the IF amplifier were optimized by fine-tuning the resistors at LOBIAS and IFBIAS during characterization at the factory. These cur- rents should not be adjusted. If the 383 Ω (±1%) and/or 523 Ω (±1%) resistor values are not readily available, substitute standard ±5% values: 390 Ω and 520Ω, respectively. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and induc- tance. For best performance, route the ground pin traces directly to the exposed pad underneath the package. This pad should be connected to the ground plane of the board by using multiple vias under the device to provide the best RF/thermal conduction path. Solder the exposed pad on the bottom of the device package to a PC board exposed pad. Power Supply Bypassing Proper voltage supply bypassing is essential for high- frequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the typical application circuit. Place the TAP bypass capacitor to ground with- in 100 mils of the TAP pin. Chip Information TRANSISTOR COUNT: 989 PROCESS: SiGe BiCMOS High-Linearity 1700MHz to 2200MHz Down- Conversion Mixer with LO Buffer/Switch _______________________________________________________________________________________ 9 COMPONENT VALUE SIZE DESCRIPTION C1 4pF 0603 Microwave capacitor C2, C6, C7, C9, C10 22pF 0603 Microwave capacitors C3, C5, C8 0.01µF 0603 Capacitors C4 10pF 0603 Microwave capacitor C11, C12, C13 150pF 0603 Microwave capacitors L1, L2 470nH 1008 Wire-wound high-Q inductors L3 10nH 0805 Wire-wound high-Q inductor R1 523 Ω 0603 ±1% resistor R2 383 Ω 0603 ±1% resistor R3, R4 7.2 Ω 1206 ±1% resistors R5 200 Ω 0603 ±5% resistor T1 4:1 (200:50) — IF balun Table 1. Component List |
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