3

®

OPA628

OPA628

1

2

3

4

5

6

7

8

No Internal Connection

+V

Inverting Input

Non-Inverting Input

–V

Output

–V

+V

OPA628AU

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

Rated Voltage

±V

CC

±5

VDC

Derated Performance

±V

CC

±4.5

±6

VDC

Current, Quiescent

29

32

mA

Current, Quiescent

31

35

mA

TEMPERATURE RANGE

Specification: AU

–40

+85

°C

Storage:

AU

Ambient Temperature

–55

+125

°C

θ

JA

AU

Junction-to-Ambient

100

°C/W

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.

ELECTRICAL

NOTES: (1) Full power response = slew rate/(2

πVpeak). (2) Time for output to resume linear operation after saturation.

PIN CONFIGURATION

Top View

8-Pin Plastic SOIC

PACKAGE DRAWING

PRODUCT

PACKAGE

OPA628AU

SO-8 Surface Mount

182

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

PACKAGE/ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS

Supply ..............................................................................................

±7VDC

Differential Input Voltage ......................................................................... 5V

Input Voltage Range ..................................... See Applications Information

Storage Temperature Range: AP, AU ............................ –55

°C to +125°C

Lead Temperature (soldering, SOIC 3s) ........................................ +260

°C

Output Short Circuit to Ground (+25

°C) ................. Continuous to Ground

NOTE: (1) Packages must be derated based on specified

θ

must be observed.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.