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XHP50 Datasheet(PDF) 2 Page - Cree, Inc |
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XHP50 Datasheet(HTML) 2 Page - Cree, Inc |
2 / 33 page Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo and SC5 Technology™ are trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 2 XLamp® XHp50 LED CHArACtEristiCs XHP50 LEDs are tested and binned in production in the 12-V configuration. See the Mechanical Dimensions section on page 30 for pad layout options. Characteristics unit Minimum typical Maximum Thermal resistance, junction to solder point °C/W 1.2 viewing angle (FWHM) degrees 120 Temperature coefficient of voltage (6 V)* mV/°C -4.5 Temperature coefficient of voltage (12 V) mV/°C -9 ESD withstand voltage (HBM per Mil-Std-883D) v 8000 DC forward current (6 V)* mA 3000 DC forward current (12 V) mA 1500 Reverse voltage v -5 Forward voltage (6 V, @ 1400 mA, 85 °C)* v 5.75 6.3 Forward voltage (12 V, @ 700 mA, 85 °C) v 11.5 12.6 LeD junction temperature °C 150 Note: * Data for the 6-V configuration is calculated and for reference only. |
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