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XHP70A-00-0000-0D0HM40E2 Datasheet(PDF) 1 Page - Cree, Inc |
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XHP70A-00-0000-0D0HM40E2 Datasheet(HTML) 1 Page - Cree, Inc |
1 / 31 page Product family data sheet Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo and SC5 Technology™ are trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Cree® XLamp® XHP70 LEDs ProDuCt DEsCriPtion Powered by Cree’s groundbreaking SC5 Technology™ Platform, the XLamp XHP70 LeD is a member of Cree’s extreme High Power (XHP) class of LEDs that redefines lumen density and reliability to radically reduce system costs by up to 40 percent. At its maximum current, the XHP70 LeD delivers twice the light output of the XLamp MK-R LeD, with similar lumens per watt and without increasing the package footprint. The XHP70 LeD also achieves longer lifetime at higher operating temperatures than previous LeD technology. The result is significantly lower thermal, mechanical and optical costs at the system level. FEAturEs • Available in white, configurable to 6 V or 12 V by PCB layout • Available in 5-step easyWhite® bins at 3000 K to 5000 K CCT, 3-step EasyWhite bins at 2700 K to 5000 K and 2-step EasyWhite bins at 2700 K to 4000 K CCT • Available in ANSI white bins at 3000 K to 7000 K CCT • Available in standard, 70-, 80-, and 90-minimum CRI options • Binned at 85 °C • Maximum drive current: 4800 mA (6 V), 2400 mA (12 V) • Low thermal resistance: 0.9 °C/W • Wide viewing angle: 120° • Unlimited floor life at ≤ 30 ºC/85% RH • Reflow solderable - JEDEC J-STD-020C • RoHS and ReACh compliant • UL® recognized component (e349212) tAbLE oF ContEnts Characteristics ..............................................2 Flux Characteristics, easyWhite® Order Codes and Bins .............................................3 Flux Characteristics, ANSI White Order Codes and Bins .............................................6 Relative Spectral Power Distribution ...........9 Relative Flux vs. Junction Temperature.......9 electrical Characteristics........................... 10 Relative Flux vs. Current ............................ 11 Relative Chromaticity vs Current............... 12 Relative Chromaticity vs Temperature...... 13 Typical Spatial Distribution........................ 13 Thermal Design.......................................... 14 Performance Groups – Luminous Flux..... 15 Performance Groups – Chromaticity........ 15 Cree’s Standard White Chromaticity Regions Plotted on the CIe 1931 Curve.... 19 Cree’s Standard Cool White Kits Plotted on ANSI Standard Chromaticity Regions.. 22 Cree’s Standard Warm and Neutral White Kits Plotted on ANSI Standard Chromaticity Regions ................................ 23 Bin and Order-Code Format....................... 24 Reflow Soldering Characteristics.............. 25 Notes .......................................................... 26 Mechanical Dimensions ............................ 28 Electrical Configuration ............................. 30 Tape and Reel............................................. 30 Packaging................................................... 31 |
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