MC74HC7266

High–Speed CMOS Logic Data

DL129 — Rev 6

5

MOTOROLA

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC DIP PACKAGE

CASE 646–06

ISSUE L

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUM

MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

4. ROUNDED CORNERS OPTIONAL.

1

7

14

8

B

A

F

H

G

D

K

C

N

L

J

M

SEATING

PLANE

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.715

0.770

18.16

19.56

B

0.240

0.260

6.10

6.60

C

0.145

0.185

3.69

4.69

D

0.015

0.021

0.38

0.53

F

0.040

0.070

1.02

1.78

G

0.100 BSC

2.54 BSC

H

0.052

0.095

1.32

2.41

J

0.008

0.015

0.20

0.38

K

0.115

0.135

2.92

3.43

L

0.300 BSC

7.62 BSC

M

0

10

0

10

N

0.015

0.039

0.39

1.01

_

_

_

_

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751A–03

ISSUE F

MIN

MIN

MAX

MAX

MILLIMETERS

INCHES

DIM

A

B

C

D

F

G

J

K

M

P

R

8.55

3.80

1.35

0.35

0.40

0.19

0.10

0

°

5.80

0.25

8.75

4.00

1.75

0.49

1.25

0.25

0.25

7

°

6.20

0.50

0.337

0.150

0.054

0.014

0.016

0.008

0.004

0

°

0.228

0.010

0.344

0.157

0.068

0.019

0.049

0.009

0.009

7

°

0.244

0.019

1.27 BSC

0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

–A–

–B–

G

C

K

SEATING

PLANE

M

J

°

1

7

8

14

0.25 (0.010)

T

B

A

M

S

S

B

M

F

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,

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MC74HC7266/D

*MC74HC7266/D*