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EE2-3TNUH-L Datasheet(PDF) 6 Page - Kemet Corporation |
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EE2-3TNUH-L Datasheet(HTML) 6 Page - Kemet Corporation |
6 / 18 page 6 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R7002_EC2_EE2 • 2/27/2014 Miniature Signal Relays – EC2/EE2 Series Soldering Process EC2 – Through-hole Mounting Automatic Soldering Preheating: 110–120°C / 110 seconds (maximum) Solder temperature: 260°C maximum Solder time: 5 seconds maximum Note: KEMET recommends cooling down a printed circuit board to less than 110°C within 40 seconds after soldering. Manual Soldering Solder temperature: 350°C maximum Solder time: 3 seconds maximum EE2 – Surface Mounting Note: Temperatureprofileshowsprintedcircuitboardsurfacetemperatureontherelayterminalportion. PleaseconsultKEMETifyouwishtouseatemperatureprofileotherthanabove. IRS Method 200 180 190 (Maximum 300) 45 (Maximum 70) 70 (Maximum 120) 220 200 180 Temperature (˚C) 220 Maximum 240˚C Time (seconds) |
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