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HD3SS460RHRT Datasheet(PDF) 6 Page - Texas Instruments |
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HD3SS460RHRT Datasheet(HTML) 6 Page - Texas Instruments |
6 / 37 page 6 HD3SS460 SLLSEM7D – JANUARY 2015 – REVISED JANUARY 2017 www.ti.com Product Folder Links: HD3SS460 Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply Voltage, VCC –0.5 4 V Differential High Speed I/O Voltages, C[R/T]X[1/2][p/n], Ln[A-D][p/n], SS[R/T]X[p/n] –0.5 2.5 V Low Speed I/O Voltages, CSBU[1/2], SBU[1/2] –0.5 4 V Control signal voltages, POL, AMSEL, EN –0.5 4 V Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 V 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage 2.7 3.3 3.6 V TA Operating free air temperature HD3SS460 0 25 70 °C HD3SS460I –40 25 85 VCM High speed port common mode voltage 0 2 V VIN Low Speed signal voltage 0 VCC Vdiff High speed port differential voltage 0 1.8 Vpp (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) HD3SS460 UNIT QFN (RNH) QFN (RHR) 30 PINS 28 PINS RθJA Junction-to-ambient thermal resistance 51.6 44.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 37.5 34.8 °C/W RθJB Junction-to-board thermal resistance 17.5 14.7 °C/W ψJT Junction-to-top characterization parameter 0.7 0.7 °C/W ψJB Junction-to-board characterization parameter 17.3 24.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 6.8 6.9 °C/W |
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