INA139, INA169

SBOS181E – DECEMBER 2000 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

INA139

–0.3

60

V

V+

Supply voltage

INA169

–0.3

75

V

–0.3

60

Analog inputs, INA139

V

–40

2

–0.3

75

Analog inputs, INA169

V

–40

2

–0.3

40

V

Input current into any pin

10

mA

Operating temperature

–55

125

°C

Junction temperature

150

°C

Storage temperature

–65

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 10mA.

6.2 ESD Ratings

VALUE

UNIT

±1000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

INA139

V+

2.7

5

40

V

Common mode voltage

2.7

12

40

V

INA169

V+

2.7

5

60

V

Common mode voltage

2.7

12

60

V

6.4 Thermal Information

INA1x9

DBV (SOT-23)

UNIT

5 PINS

Junction-to-ambient thermal resistance

168.3

°C/W

Junction-to-case (top) thermal resistance

73.8

°C/W

Junction-to-board thermal resistance

28.1

°C/W

Junction-to-top characterization parameter

2.5

°C/W

Junction-to-board characterization parameter

27.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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