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OPA316-Q1, OPA2316-Q1, OPA4316-Q1

SBOS841A – NOVEMBER 2016 – REVISED JANUARY 2017

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Product Folder Links: OPA316-Q1 OPA2316-Q1 OPA4316-Q1

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Copyright © 2016–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 6

6.1

Absolute Maximum Ratings ...................................... 6

6.2

ESD Ratings ............................................................ 6

6.3

Recommended Operating Conditions ....................... 6

6.4

Thermal Information: OPA316-Q1 ............................ 7

6.5

Thermal Information: OPA2316-Q1 .......................... 8

6.6

Thermal Information: OPA4316-Q1 .......................... 9

6.7

Electrical Characteristics......................................... 10

6.8

Typical Characteristics ............................................ 12

7

Detailed Description ............................................ 18

7.1

Overview ................................................................. 18

7.2

Functional Block Diagram ....................................... 18

7.3

Feature Description................................................. 18

7.4

Device Functional Modes........................................ 20

8

Application and Implementation ........................ 21

8.1

Application Information............................................ 21

8.2

Typical Application .................................................. 22

9

Power Supply Recommendations ...................... 25

10

Layout................................................................... 26

10.1

Layout Guidelines ................................................. 26

10.2

Layout Example .................................................... 26

11

Device and Documentation Support ................. 27

11.1

Documentation Support ........................................ 27

11.2

Related Links ........................................................ 27

11.3

Receiving Notification of Documentation Updates 27

11.4

Community Resources.......................................... 27

11.5

Trademarks ........................................................... 27

11.6

Electrostatic Discharge Caution ............................ 27

11.7

Glossary ................................................................ 27

12

Mechanical, Packaging, and Orderable

Information ........................................................... 28

4 Revision History

Changes from Original (November 2016) to Revision A

Page

•

Changed CDM classification reduced from C6 ..................................................................................................................... 1

•

Deleted OPA2316S-Q1 package and body size information from Device Information table ................................................ 1

•

Deleted SC70 (5) (OPA316-Q1), DFN (8), MSOP (8), SOIC (8) (OPA2316-Q1), and SOIC (14) packages

(OPA4316-Q1) from the Device Information table, Thermal Information tables, and pinout diagrams.................................. 1

•

Deleted OPA2316S-Q1 pin diagram and Pin Functions table in Pin Configurations and Functions section ........................ 3

•

Deleted D (SOIC) package from OPA4316-Q1 pin diagram in Pin Configurations and Functions section .......................... 5

•

Changed CDM rating from ±1500 V to ±750 V ...................................................................................................................... 6

•

Deleted OPA2316S-Q1 device thermal information in the Thermal Information table .......................................................... 7

•

Added thermal information for OPA4316-Q1 device .............................................................................................................. 9

•

Deleted the literature numbers in parentheses from the format of TI document references in the Documentation

Support section .................................................................................................................................................................... 27