Silicon PIN Diode

Rev. V1

MMP7066-11

2

2

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2

Absolute Maximum Ratings

Parameter

Absolute Maximum

Forward DC Current

150 mA

Reverse DC Voltage

500 V

Thermal Resistance

Junction to Case = 25°C/W

Junction Temperature

+175°C

Operating Temperature

-65°C to +150°C

Storage Temperature

-65°C to +150°C

Assembly Temperature

+285°C, t = 10 s

Assembly Instructions

Die attach of MMP7066-11 silicon PIN diode chips

may be accomplished with conductive epoxy or a

eutectic solder such as Au(80%)/Sn(20%). Electrical

connection to the anode may be made with a Au

wire or ribbon, utilizing thermo compression or ther-

mosonic bonding. Care should be exercised to not

employ excessive pressure or ultrasonic energy

while wire/ribbon bonding to avoid physical damage

to the die.

Handling Procedures

Please observe the following precautions to avoid

damage:

Static Sensitivity

These

electronic

devices

are

sensitive

to

electrostatic discharge (ESD) and can be damaged

by static electricity. Proper ESD control techniques

should be used when handling these Class 1A

(HBM) devices.

Environmental Capabilities

This diode is capable of meeting the environmental

requirements of MIL-STD-750.

Outline Drawing - CS11

Dimension

Min.

Nom.

Max.

A

0.016

0.018

0.020

B

0.016

0.018

0.020

C

0.006

0.010

0.012

D

—

0.010

—

Dimensions (inches)