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LM4838MT Datasheet(PDF) 7 Page - National Semiconductor (TI) |
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LM4838MT Datasheet(HTML) 7 Page - National Semiconductor (TI) |
7 / 36 page Typical Performance Characteristics MTE Specific Characteristics LM4838MTE THD+N vs Output Power LM4838MTE THD+N vs Frequency 20013370 20013371 LM4838MTE THD+N vs Output Power LM4838MTE THD+N vs Frequency 20013372 20013373 LM4838MTE Power Dissipation vs Output Power LM4838MTE (Note 18) Power Derating Curve 20013365 20013364 Note 18: These curves show the thermal dissipation ability of the LM4838MTE at different ambient temperatures given these conditions: 500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias. 2in2: The part is soldered to a 2in2, 1oz. copper plane. 1in2: The part is soldered to a 1in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. www.national.com 7 |
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