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MHV507-19-1-W Datasheet(PDF) 2 Page - M/A-COM Technology Solutions, Inc. |
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MHV507-19-1-W Datasheet(HTML) 2 Page - M/A-COM Technology Solutions, Inc. |
2 / 4 page 2 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 2 Silicon Hyperabrupt Varactor Diode Rev. V1 MHV507-19-1 Environmental Capabilities The MHV507-19-1 silicon hyperabrupt junction varactor diode is durable and capable of reliably operating in military, commercial, and industrial environments. The device is compatible with pick-and-place assembly and is available in tape and reel. The MHV507-19-1 silicon hyperabrupt junction varactor diode is capable of meeting the environmental requirements of MIL-STD-750. ESD & Moisture Sensitivity Level Rating As are all semiconductors, silicon hyperabrupt tuning varactor diode are susceptible to damage from ESD events. Proper ESD prevention procedures should be followed. The ESD rating for this device is Class 0 (HBM). The moisture sensitivity level (MSL) rating for this part is MSL 1. Assembly Instructions Diodes may be placed onto circuit boards with pick and place manufacturing equipment from tape-reel. The devices are attached to the circuit using conventional solder re-flow or wave soldering procedures with RoHS type or Sn 60 / Pb 40 type solders. Table 1. Time-Temperature Profile for Sn60/Pb40 or RoHS Type Solders Profile Feature SnPb Solder Assembly Pb-Free Solder Assembly Average Ramp-Up Rate (TL to TP) 3°C /second maximum 3°C /second maximum Preheat: -Temperature Min (TSMIN) -Temperature Max (TSMAX) -Time (min to max)(tS) 100°C 150°C 60 - 120 s 150°C 200°C 60 - 180 s TSMAX to TL - Ramp-Up Rate 3°C /s maximum Time Maintained Above: -Temperature (TL) - Time (tL) 183°C 60 - 150 s 217°C 60 - 150 s Peak temperature (TP) 225 +0/-5°C 260 +0/-5°C Time Within 5°C of Actual Peak Temperature (tP) 10 – 30 s 20 – 40 s Ramp-Down Rate 6°C /s maximum 6°C /s maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum Figure 1. Solder Re-Flow Time-Temperature Profile |
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