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NPA1003QA-SMBPPR Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc.

Part # NPA1003QA-SMBPPR
Description  GaN on Si HEMT D-Mode Amplifier
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

NPA1003QA-SMBPPR Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc.

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GaN Wideband Power Amplifier, 28 V, 5 W
20 - 1500 MHz
Rev. V1
NPA1003QA
1
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1
Features
 GaN on Si HEMT D-Mode Amplifier
 Suitable for linear and saturated applications
 Broadband operation from 20 - 1500 MHz
 28 V Operation
 16 dB Gain @ 1 GHz
 42% PAE @ 1 GHz
 100% RF Tested
 50 Ω Input / Output Matched
 Lead-Free 4 mm 16-lead QFN plastic Package
 RoHS* Compliant and 260°C Reflow Compatible
Description
The NPA1003QA is a wideband GaN power
amplifier optimized for 20 - 1500 MHz operation.
This amplifier has been designed for saturated and
linear operation with output levels to 5 W (37 dBm)
assembled in a lead-free 4 mm 16-lead QFN plastic
package.
The NPA1003QA is ideally suited for broadband
general purpose, test and measurement, defense
communications, land mobile radio and wireless
infrastructure.
Ordering Information
*Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
Part Number
Package
NPA1003QA
Bulk
NPA1003QA-SMBPPR
sample
Functional Schematic
Pin No.
Pin Name
Function
1
N/C
No Connection
2
RFIN / VG
RF Input / Gate Voltage
3
RFIN / VG
RF Input / Gate Voltage
4
N/C
No Connection
5-8
N/C
No Connection
9
N/C
No Connection
10
RFOUT / VD
RF Output / Drain Voltage
11
RFOUT / VD
RF Output / Drain Voltage
12
N/C
No Connection
13-16
N/C
No Connection
17
Paddle2
Ground
Pin Designations1,2
1. All no connection pins may be left floating or grounded.
2. The exposed pad centered on the package bottom must be
connected to RF and DC ground. This path must also provide
a low thermal resistance heat path.
17
1
2
3
12
11
4
9
10
RFOUT / VD
RFOUT / VD
N/C
RFIN / VG
RFIN / VG
N/C
N/C
N/C
Paddle
5
6
7
8
16
15
14
13
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C


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