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LM4866 Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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LM4866 Datasheet(HTML) 5 Page - National Semiconductor (TI) |
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5 / 21 page  Typical Performance Characteristics LQ Specific Characteristics LM4866LQ THD+N vs Output Power LM4866LQ THD+N vs Frequency 20018666 20018668 LM4866LQ THD+N vs Output Power LM4866LQ THD+N vs Frequency 20018665 20018667 LM4866LQ Power Dissipation vs Power Output LM4866LQ (Note 17) Power Derating Curve 20018664 20018695 Note 17: This curve shows the LM4866LQ’s thermal dissipation ability at different ambient temperatures given this condition: The LLP package’s DAP is soldered to a 2.5in2, 1oz. copper plane. www.national.com 5 |
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