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LM4873 Datasheet(PDF) 7 Page - National Semiconductor (TI) |
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LM4873 Datasheet(HTML) 7 Page - National Semiconductor (TI) |
7 / 19 page Typical Performance Characteristics MTE-1 (28 pin) Specific Characteristics Note 21: These curves show the thermal dissipation ability of the LM4835MTE at different ambient temperatures given these conditions: 500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias. 2in2: The part is soldered to a 2in2, 1oz. copper plane. 1in2: The part is soldered to a 1in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. Non-MTE Specific Characteristics LM4873MTE-1 THD+N vs Output Power DS100993-97 LM4873MTE-1 THD+N vs Frequency DS100993-99 LM4873MTE-1 THD+N vs Output Power DS100993-96 LM4873MTE-1 THD+N vs Frequency DS100993-98 LM4873MTE-1 Power Dissipation vs Power Output DS100993-90 LM4873MTE-1(Note 21) Power Derating Curve DS100993-A0 THD+N vs Frequency DS100993-3 THD+N vs Frequency DS100993-4 THD+N vs Frequency DS100993-5 www.national.com 7 |
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