D

E

TOP VIEW

X

Y

A1

A

SIDE VIEW

Z

b

e

15.0000 (x4)

BOTTOM VIEW

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

Ironwood Package Code : BGA208C

DIM

Minimum Maximum

A

1

2.25

A1

0.37

0.57

b

0.5

0.7

D

17.0 +/- 0.2mm

E

17.0 +/- 0.2mm

e

1.00

ARRAY

16X16

PIN COUNT

208

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Compatible BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 10/26/2015

Material: N/A

Finish: N/A

Weight: 29.65

CBT-BGA-6056 Drawing

SCALE: 4:1

SHEET: 3 OF 5

ENG: V. Panavala

FILE: CBT-BGA-6056 Dwg

DRAWN BY: M. Raske