D

E

17.00

18.80

0.2

X

Y

Z

A

A1

L

b

21.60

e

DETAIL L

SCALE 6 : 1

0.25 Z

0.2 Z

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

Ironwood Package Code: BGA602A

DIM

Minimum

Maximum

A

-

4

A1

0.3

0.5

b

0.4

0.60

D

23.00 BSC

E

23.00 BSC

e

0.8 BSC

ARRAY

28 X 28

PIN COUNT

602

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Compatible BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 3/20/2014

Material: Material <not specified>

Finish: --

Weight: 140.24

CBT-BGA-6039 Drawing

SCALE: 2.25:1

SHEET: 3 OF 5

ENG: B. Schatz

FILE: CBT-BGA-6039 Dwg

DRAWN BY: M. Raske