1.71±0.10 THRU (x4)

non plated mounting hole

0.85±0.025 THRU (x2)

non plated alignment hole

4.8225±0.025

2.2825±0.025

7.55

7.1750

2.5375*

19.725±0.125 backing plate outline

2.1625

7.3625 (x4)

14.725±0.050

0.46

17.600±0.125 socket base outline

17.225±0.125

socket base outline

37.225

socket outline

32.725 socket outline

39.225

socket lid outline

23.00 socket lid outline

8.50 latch

6.35 latch

18.450 Bottom Guide

18.077

Bottom

Guide

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

*Note: BGA pattern is not symmetrical

with respect to the mounting holes. It is

shifted by 0.375mm to the right.

no component area

6.07mm maximum

component height

12.37mm maximum

component height

4.67mm maximum

component height

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 01/08/2015

Material: N/A

Finish: N/A

Weight: 77.57

CBT-BGA-6045 Drawing

SCALE: 3.1:1

SHEET: 2 OF 4

ENG: E. Smolentseva

FILE: CBT-BGA-6045 Dwg

DRAWN BY: M. Raske