CLAMSHELL SOCKET LID ASSEMBLY

DROP IN

COMPRESSION

PLATE

POP CHIP

SPACER

POP CHIP

SOLDERED

TO BGA500

PACKAGE

PIN A1

ORIENATION

MARK

DROP IN

COMPRESSION

PLATE

ORIENTATION

MARK

SOCKET BASE

ASSEMBLY

SOCKET ASSEMBLY INSTRUCITON

WHEN USED FOR THE POP CHIP

SOLDERD TO BGA500 PACKAGE:

1. Place BGA500 package into socket

base assembly. NOTE PIN A1

orienation.

2. Place POP CHIP SPACER into socket

base cavity.

3. Place DROP IN COMPRESSION

PLATE into socket base cavity. NOTE

PIN A1 ORIENTATION.

4. Place clamshell socket lid assembly

over socket base and secure it with dual

latch.

5. Apply torque.

Recommended torque: 3.8 in-lbs.

6. Test.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Socket assy_wo_POP_pogonest

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 03/04/2015

Material: N/A

Finish: N/A

Weight: 120.45

CBT-BGA-7506 Drawing

SCALE: 1.75:1

SHEET: 8 OF 9

ENG: S. Faiz

FILE: CBT-BGA-7506 Dwg

DRAWN BY: M. Raske