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EMT1DXV6 Datasheet(PDF) 1 Page - ON Semiconductor

Part # EMT1DXV6
Description  Dual General Purpose Transistor
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

EMT1DXV6 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2014
November, 2014 − Rev. 2
1
Publication Order Number:
EMT1DXV6T1/D
EMT1DXV6
Dual General Purpose
Transistor
PNP Dual
This transistor is designed for general purpose amplifier
applications. It is housed in the SOT−563 which is designed for low
power surface mount applications.
Features
Lead−Free Solder Plating
Low VCE(SAT), t0.5 V
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector − Emitter Voltage
VCEO
−60
V
Collector − Base Voltage
VCBO
−50
V
Emitter − Base Voltage
VEBO
−6.0
V
Collector Current − Continuous
IC
−100
mAdc
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
Total Device Dissipation
TA = 25°C
Derate above 25
°C
PD
357
(Note 1)
2.9
(Note 1)
mW
mW/
°C
Thermal Resistance,
Junction-to-Ambient
RqJA
350
(Note 1)
°C/W
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
Total Device Dissipation
TA = 25°C
Derate above 25
°C
PD
500
(Note 1)
4.0
(Note 1)
mW
mW/
°C
Thermal Resistance,
Junction-to-Ambient
RqJA
250
(Note 1)
°C/W
Junction and Storage
Temperature Range
TJ, Tstg
− 55 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 @ Minimum Pad.
SOT−563
CASE 463A
STYLE 1
Q1
(1)
(2)
(3)
(4)
(5)
(6)
Q2
http://onsemi.com
MARKING DIAGRAM
3T M
G
G
3T = Specific Device Code
M
= Month Code
G
= Pb−Free Package
1
(Note: Microdot may be in either location)
1
6
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION


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