2.1125 *

1.8625

2.54

17.725±0.050

1.250±0.125 (x2)

5.08

39.225±0.125

Socket base size

0.50 typ.

1.6125 *

21.7250±0.1250 (x4)

Backing plate

0.85±0.05 (x2)

Non plated alignment hole

1.71±0.10 (x4)

Non plated mounting hole

0.25 pad (x528)

21.725

Backing Plate

20.475±0.125

20.225±0.125

32.600±0.125

Socket Base size

Orientation Mark

Note: BGA pattern is shifted to the right by

0.25mm with respect to the mounting holes.

Max Component Ht. 15mm

Max Component Ht. 3.4mm

Max Component Ht. 2.4mm--close latch

Max Component Ht. 3.2mm--open latch

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: same or higher

than solder mask

Keep out area

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 2/13/13

Material: Material <not specified>

Finish:

Weight: 67.00

CHBT-BGA-7002 Drawing

SCALE: 3:1

SHEET: 2 OF 5

ENG: S. Huang

FILE: CHBT-BGA-7002

DRAWN BY: S. Huang