SUP, SUPSW, EN to PGND..................................-0.3V to +42V

LX (Note 1)............................................................-0.3V to +42V

SUP to SUPSW....................................................-0.3V to +0.3V

BIAS to AGND.........................................................-0.3V to +6V

SYNCOUT, FOSC, COMP, FSYNC,

OUT to PGND .......................................................-0.3V to +12V

BST to LX (Note 1)..................................................-0.3V to +6V

AGND to PGND...................................................-0.3V to + 0.3V

LX Continuous RMS Current...................................................3A

Output Short-Circuit Duration....................................Continuous

TSSOP (derate 26.1mw/NC above +70°C)............2088.8mW

TQFN (derate 28.6mw/°C above +70°C) ...............2285.7mW

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

TSSOP

TQFN

(Note 2)

*As per JEDEC51 standard (multilayer board).

Note 1: Self-protected against transient voltages exceeding these limits for ≤ 50ns under normal operation and loads up to the

maximum rated output current.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

MAX17244

3.5V–36V, 2.5A, Synchronous Buck Converter

With 28µA Quiescent Current and Reduced EMI

www.maximintegrated.com

Maxim Integrated │ 3

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

3.5

36

V

Line Transient Event Supply

Voltage

42

V

Supply Current

28

40

µA

Shutdown Supply Current

5

8

µA

BIAS Regulator Voltage

4.7

5

5.4

V

BIAS Undervoltage Lockout

2.95

3.15

3.40

V

BIAS Undervoltage-Lockout

Hysteresis

450

650

mV

Thermal Shutdown Threshold

+175

°C

Thermal Shutdown Threshold

Hysteresis

15

°C