RP114x

NO. EA-236-160824

8

PACKAGE INFORMATION

Power Dissipation (DFN(PLP)1010-4)

Measurement Conditions below.

Measurement Conditions

Standard Land Pattern

Environment

Mounting on Board (Wind Velocity=0m/s)

Board Material

Glass Cloth Epoxy Plastic (Double-sided)

Board Dimensions

40mm x 40mm x 1.6mm

Copper Ratio

Top-side: Approx. 50%, Back-side: Approx. 50%

Through-hole

φ 0.54mm x 24pcs

Measurement Result

(Ta=25

°C)

Standard Land Pattern

Power Dissipation

400mW (Tjmax=125

°C)

500mW (Tjmax=150

°C)

Thermal Resistance

θja=(125-25°C)/0.4W=250 °C/W

θjc=67 °C/W

Note: The above graph shows the power dissipation of the package based on Tjmax=125ºC and

Tjmax=150ºC. Operating the IC within the shaded area in the graph might have an influence on its

lifetime.

Operating time must be within the time limit described in the table below.

Operating Time

Estimated Years

(Operating 4 hrs/ day)

13,000 hours

9 Years

40

Measurement Board Pattern

IC Mount Area (Unit: mm)