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LM6132BIM Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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LM6132BIM Datasheet(HTML) 5 Page - National Semiconductor (TI) |
5 / 14 page 24V DC Electrical Characteristics Unless otherwise specified, all limits guaranteed for T J = 25˚C, V + = 24V, V− = 0V, V CM =VO =V +/2 and R L > 1MΩ to VS/2. Boldface limits apply at the temperature extreme Symbol Parameter Conditions Typ (Note 5) LM6134AI LM6134BI Units LM6132AI LM6132BI Limit Limit (Note 6) (Note 6) V OS Input Offset Voltage 1.7 3 7 mV 59 max I B Input Bias Current 0V ≤ V CM ≤ 24V 125 nA I OS Input Offset Current 4.8 nA R IN Input Resistance 210 M Ω CMRR Common Mode 0V ≤ V CM ≤ 24V 80 dB Rejection Ratio PSRR Power Supply 2.7V ≤ V S ≤ 24V 82 dB Rejection Ratio V CM Input Common-Mode −0.25 0 0 V min Voltage Range 24.25 24 24 V max A V Large Signal R L = 10k 102 V/mV Voltage Gain V O Output Swing R L = 10k 0.075 0.15 0.15 V max 23.86 23.8 23.8 V min I S Supply Current Per Amplifier 390 450 450 µA 490 490 max 24V AC Electrical Characteristics Unless otherwise specified, all limits guaranteed for T J = 25˚C, V + = 24V, V− = 0V, V CM =VO =V +/2 and R L > 1MΩ to VS/2. Symbol Parameter Conditions Typ (Note 5) LM6134AI LM6134BI Units LM6132AI LM6132BI Limit Limit (Note 6) (Note 6) GBW Gain-Bandwidth Product R L = 10k, f = 20 kHz 11 MHz θ m Phase Margin R L = 10k 23 deg G m Gain Margin R L = 10k 12 dB THD + N Total Harmonic A V = +1, VO = 20VP-P 0.0015 % Distortion and Noise f = 10 kHz Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is in- tended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical characteristics. Note 2: Human body model, 1.5 k Ω in series with 100 pF. Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Note 4: The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD =(TJ(max) −TA)/θJA. All numbers apply for packages soldered directly into a PC board. Note 5: Typical Values represent the most likely parametric norm. Note 6: All limits are guaranteed by testing or statistical analysis. www.national.com 5 |
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