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C0603C107M7PACTU Datasheet(PDF) 11 Page - Kemet Corporation |
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C0603C107M7PACTU Datasheet(HTML) 11 Page - Kemet Corporation |
11 / 22 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 2/29/2016 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method TerminalStrength JIS–C–6429 Appendix1,Note:Forceof1.8kgfor60seconds. Board Flex JIS–C–6429 Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmforC0G. Flexibleterminationsystem–3.0mm(minimum). Solderability J–STD–002 Magnification50X.Conditions: a)MethodB,4hoursat155°C,dryheatat235°C b)MethodBat215°Ccategory3 c)MethodD,category3at260°C TemperatureCycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours+/-4hoursaftertestconclusion. BiasedHumidity MIL–STD–202Method103 LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor. Measurementat24hours+/-4hoursaftertestconclusion. LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor. Measurementat24hours+/-4hoursaftertestconclusion. MoistureResistance MIL–STD–202Method106 t=24hours/cycle.Steps7aand7bnotrequired. Measurementat24hours+/-4hoursaftertestconclusion. ThermalShock MIL–STD–202Method107 −55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20seconds.Dwell time–15minutes.Air–Air. HighTemperatureLife MIL–STD–202Method108 /EIA–198 1,000hoursat85°Cwith2Xratedvoltageappliedexcludingthefollowing: Case Size Capacitance Applied Voltage 0402 ≥0.22µF 1.5 X 0603 ≥1.0µF 0805 ≥4.7µF 1206 ≥2.2µF 1210 ≥10µF StorageLife MIL–STD–202Method108 150°C,0VDCfor1,000hours. Vibration MIL–STD–202Method204 5g'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick7secure pointsononelongsideand2securepointsatcornersofoppositesides.Partsmountedwithin2" fromanysecurepoint.Testfrom10–2,000Hz MechanicalShock MIL–STD–202Method213 Figure1ofMethod213,ConditionF. Resistance to Solvents MIL–STD–202Method215 Addaqueouswashchemical,OKEMCleanorequivalent. Storage and Handling Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustinother environments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,andlongterm storage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarpandtapepeelforcemay increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximumstoragehumiditynotexceed70% relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof chlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstockshouldbeusedpromptly,preferablywithin1.5yearsof receipt. |
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