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MAX1546ETL Datasheet(PDF) 3 Page - Maxim Integrated Products |
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MAX1546ETL Datasheet(HTML) 3 Page - Maxim Integrated Products |
3 / 8 page II. Manufacturing Information A. Description/Function: Dual-Phase, Quick-PWM Controller for IMVP CPU Core Power Supplies B. Process: S12 (Standard 1.2 micron silicon gate CMOS) C. Number of Device Transistors: 11,015 D. Fabrication Location: California or Oregon, USA E. Assembly Location: Thailand and USA F. Date of Initial Production: January, 2003 III. Packaging Information A. Package Type: 40-Pin QFN (6x6) B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Silver-filled Epoxy E. Bondwire: Gold (1.3 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: # 05-9000-0383 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-112: Level 1 IV. Die Information A. Dimensions: 130 x 172 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: 1.2 microns (as drawn) F. Minimum Metal Spacing: 1.2 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw |
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