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AD9163-FMCC-EBZ Datasheet(PDF) 10 Page - Analog Devices |
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AD9163-FMCC-EBZ Datasheet(HTML) 10 Page - Analog Devices |
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10 / 124 page  Data Sheet AD9163 Rev. 0 | Page 9 of 123 ABSOLUTE MAXIMUM RATINGS Table 10. Parameter Rating ISET, VREF to VBG_NEG −0.3 V to VDD25_DAC + 0.3 V SERDINx±, VTT_1P2, SYNCOUT± −0.3 V to SYNC_VDD_3P3 + 0.3 V OUTPUT± to VNEG_N1P2 −0.3 V to VDD25_DAC + 0.3 V SYSREF± GND − 0.5 V to +2.5 V CLK± to Ground −0.3 V to VDD12_CLK + 0.3 V RESET, IRQ, CS, SCLK, SDIO, SDO to Ground −0.3 V to IOVDD + 0.3 V Junction Temperature1 fDAC = 6 GSPS 105°C fDAC ≤ 5.1 GSPS 110°C Ambient Operating Temperature Range (TA) −40°C to +85°C Storage Temperature Range −65°C to +150°C 1 Some operating modes of the device may cause the device to approach or exceed the maximum junction temperature during operation at supported ambient temperatures. Removal of heat from the device may require additional measures such as active airflow, heat sinks, or other measures. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. REFLOW PROFILE The AD9163 reflow profile is in accordance with the JEDEC JESD204B criteria for Pb-free devices. The maximum reflow temperature is 260°C. THERMAL MANAGEMENT The AD9163 is a high power device that can dissipate nearly 3 W depending on the user application and configuration. Because of the power dissipation, the AD9163 uses an exposed die package to give the customer the most effective method of controlling the die temperature. The exposed die allows cooling of the die directly. Figure 3 shows the profile view of the device mounted to a user printed circuit board (PCB) and a heat sink (typically the aluminum case) to keep the junction (exposed die) below the maximum junction temperature in Table 10. CUSTOMER CASE (HEAT SINK) CUSTOMER THERMAL FILLER SILICON (DIE) IC PROFILE PACKAGE SUBSTRATE CUSTOMER PCB Figure 3. Typical Thermal Management Solution THERMAL RESISTANCE Typical θJA and θJC values are specified for a 4-layer JEDEC 2S2P high effective thermal conductivity test board for balled surface-mount packages. θJA is obtained in still air conditions (JESD51-2). Airflow increases heat dissipation, effectively reducing θJA. θJC is obtained with the test case temperature monitored at the bottom of the package. ΨJT is thermal characteristic parameters obtained with θJA in still air test conditions but are not applicable to the CSP_BGA package. Estimate the junction temperature (TJ) using the following equations: TJ = TT + (ΨJT × PDISS) where: TT is the temperature measured at the top of the package. PDISS is the total device power dissipation. Table 11. Thermal Resistance Package Type θJA θJC Unit BC-169-2 14.6 0.02 °C/W ESD CAUTION |
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