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MB05S Datasheet(PDF) 1 Page - Thinki Semiconductor Co., Ltd. |
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MB05S Datasheet(HTML) 1 Page - Thinki Semiconductor Co., Ltd. |
1 / 2 page F Fe ea attu urre es s M Ma ax xiim mu um m R Ra attiin ng gs s .275(7)MAX .165(4.2) .106(2.7) .051(1.3) .043(1.1) .008(.20) .067(1.7) .150(3.8) .090(2.3) .035(0.9) .027(0.7) .057(1.3) C .02(.5) MDS Unit: inch(mm) s c i t s i r e t c a r a h C l a c i r t c e l E d n a s g n i t a R m u m i x a M (T A=25 oC unless otherwise noted) r e t e m a r a Ps l o b m y S s t i n U e g a t l o v e s r e v e r k a e p e v i t i t e p e r m u m i x a MV M R R s t l o V e g a t l o v S M R m u m i x a MV S M R s t l o V e g a t l o v g n i k c o l b C D m u m i x a MV C D s t l o V t n e r r u c d e i f i t c e r t u p t u o d r a w r o f e g a r e v a m u m i x a M . B . C . P y x o p e - s s a l g n o ) 1 . g i F e e s ( e t a r t s b u s m u n i m u l a n o I ) V A ( F 5 . 0 ) 1 ( 8 . 0 ) 2 ( p m A e v a w - e n i s f l a h e l g n i s s m 3 . 8 t n e r r u c e g r u s d r a w r o f k a e P ) d o h t e M C E D E J ( d a o l d e t a r n o d e s o p m i r e p u s I M S F 0 . 5 3s p m A ) s m 3 . 8 < t ( g n i s u f r o f g n i t a RI2t0 . 5A2 c e s A 4 . 0 t a g e l r e p p o r d e g a t l o v d r a w r o f s u o e n a t n a t s n i m u m i x a MV F 0 . 1t l o V T t a t n e r r u c e s r e v e r C D m u m i x a M A 5 2 = oC T g e l r e p e g a t l o v g n i k c o l b C D d e t a r A 5 2 1 = oC I R 0 . 5 0 0 1 uA g e l r e p e c n a t s i s e r l a m r e h t l a c i p y T R θ A J R θ A J R θ L J 5 8 ) 1 ( 0 7 ) 2 ( 0 2 ) 1 ( o W / C z H M 0 . 1 , V 0 . 4 t a g e l r e p e c n a t i c a p a c n o i t c n u j l a c i p y TC J 3 1 pF e g n a r e r u t a r e p m e t e g a r o t s d n a n o i t c n u j g n i t a r e p OT J T , G T S 0 5 1 + o t 5 5 - oC Notes: 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad e s a h P - e l g n i S d e t a v i s s a P s s a l G e r u t a i n i M F s t l o V 0 0 3 1 o t 0 5 e g a t l o V e s r e v e R Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Glass passivated chip junctions High surge overload rating: 35A peak Saves space on printed circuit boards High temperature soldering guaranteed: 260oC/10 seconds. Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Mounting Position: Any Weight: 0.078 oz., 0.22 g MB05S MB2S MB4S MB6S MB8S MB13S MB10S 50 200 400 600 800 1000 1300 35 140 280 420 560 700 910 50 200 400 600 800 1000 1300 ® MB05S thru MB13S © 2006 Thinki Semiconductor Co.,Ltd. http://www.thinkisemi.com/ Page 1/2 Pb Free Plating Product Pb MB05S thru MB13S 0.8 Amp Surface Mount Single Phase Bridge Rectifiers |
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