MJD200 (NPN), MJD210 (PNP)

http://onsemi.com

7

PACKAGE DIMENSIONS

DPAK

CASE 369C

ISSUE D

STYLE 1:

PIN 1. BASE

2. COLLECTOR

3. EMITTER

4. COLLECTOR

5.80

0.228

2.58

0.101

1.6

0.063

6.20

0.244

3.0

0.118

6.172

0.243

mm

inches

SCALE 3:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

b

D

E

b3

L3

L4

b2

e

M

0.005 (0.13)

C

c2

A

c

C

Z

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

D

0.235

0.245

5.97

6.22

E

0.250

0.265

6.35

6.73

A

0.086

0.094

2.18

2.38

b

0.025

0.035

0.63

0.89

c2

0.018

0.024

0.46

0.61

b2

0.030

0.045

0.76

1.14

c

0.018

0.024

0.46

0.61

e

0.090 BSC

2.29 BSC

b3

0.180

0.215

4.57

5.46

L4

−−−

0.040

−−−

1.01

L

0.055

0.070

1.40

1.78

L3

0.035

0.050

0.89

1.27

Z

0.155

−−−

3.93

−−−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCHES.

3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-

MENSIONS b3, L3 and Z.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL

NOT EXCEED 0.006 INCHES PER SIDE.

5. DIMENSIONS D AND E ARE DETERMINED AT THE

OUTERMOST EXTREMES OF THE PLASTIC BODY.

6. DATUMS A AND B ARE DETERMINED AT DATUM

PLANE H.

12

3

4

H

0.370

0.410

9.40

10.41

A1

0.000

0.005

0.00

0.13

L1

0.108 REF

2.74 REF

L2

0.020 BSC

0.51 BSC

A1

H

DETAIL A

SEATING

PLANE

A

B

C

L1

L

H

L2

GAUGE

PLANE

DETAIL A

ROTATED 90 CW

5

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