ZSPM4013B Datasheet

© 2016 Integrated Device Technology, Inc.

5

January 25, 2016

1

ZSPM4013B Characteristics

Important: Stresses beyond those listed under “Absolute Maximum Ratings” (section 1.1) may cause permanent

damage to the device. These are stress ratings only. Functional operation of the device at these or any other

conditions beyond those indicated under “Recommended Operating Conditions” (section 1.3) is not implied.

Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

1.1.

Absolute Maximum Ratings

Over operating free–air temperature range unless otherwise noted.

Table 1.1

Absolute Maximum Ratings

Parameter

Value

1)

UNIT

Voltage on VCC pin

-0.3 to 20

V

Voltage on BST pin

-0.3 to (VCC+6)

V

Voltage on VSW pin

-1 to 20

V

Voltage on EN, PG, FB pins

-0.3 to 6

V

Electrostatic Discharge – Human Body Model

2)

+/-2k

V

Electrostatic Discharge – Charge Device Model

2)

+/-500

V

Lead Temperature (soldering, 10 seconds)

260

°C

1)

All voltage values are with respect to network ground terminal.

2)

ESD testing is performed according to the respective JESD22 JEDEC standard.

1.2.

Thermal Characteristics

Table 1.2

Thermal Characteristics

Parameter

Symbol

Value

Unit

Thermal Resistance Junction to Air

1)

θ

JA

34.5

°C/W

Thermal Resistance Junction to Case

1)

θ

Jc

2.5

°C/W

Storage Temperature Range

-65 to 150

°C

Maximum Junction Temperature

150

°C

Operating Junction Temperature Range

-40 to 125

°C

1)

Assumes 1 in

°C ambient temperature.