2

1

3

6.00

8.00

4.00

1.0 TYP

TOP VIEW

1.59

2.87±0.25

0.51

FRONT VIEW

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE

WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.

U.S. Patent No. 8,091,222 B2

ITEM NO.

DESCRIPTION

Material

1

SF Pin Substrate

FR4 High temp

2

P-S519A, Socket Pin, 1.0mm

centers minimum, #4 clip

N/A

3

Solder Ball, ROHS Compliant

0.024" Dia

See table

PART NO.

SUFFIX

SOLDER BALL ALLOY

-42

Sn63Pb37

-42F*

Sn96.5Ag3.0Cu0.5

*RoHS Compliant

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: BGA Surface Mount Foot

24 positions 5x5 array 1.00 mm pitch receptacles to solder balls

Primary dimension units are millimeters, Secondary dimension units are [inches].

STATUS: Released

REV. A

DATE: 01/14/2014

Material: N/A

Finish: N/A

Weight: N/A

SCALE: 7:1

SHEET: 1 OF 1

ENG: E. Smolentseva

FILE: SF-BGA24C-B-42 Dwg

SF-BGA24C-B-42 Drawing

SF-BGA24C-B-42F Drawing