TC1301

REV.2_04/12/2004

TRANSCOM, INC., 90 Dasoong 7

Web-Site: www.transcominc.com.tw

Phone: 886-6-5050086

Fax: 886-6-5051602

P 6 / 6

TOM2 MODEL PARAMETERS

Parameters

Parameters

VTO

-0.43283 V

VMAX

0.5 V

ALPHA

9.54

CGD

0.0554 pF

BETA

0.49

CGS

6.018 pF

GAMMA

0.0416

CDS

0.1599 pF

DELTA

0.3091

RIS

5.755 Ohm

Q

0.84

RID

0.001 Ohm

NG

0.1

VBR

9 V

ND

0.01

RDB

94.333 Ohm

TAU

5.558 ps

CBS

0.0463 pF

RG

2.0833 Ohm

TNOM

25

°C

RD

1.358 Ohm

LS

0.01893 nH

RS

1.662 Ohm

LG

0.0576 nH

IS

1E-11 mA

LD

0.038 nH

N

1

AFAC

1

VBI

1 V

NFING

1

VDELTA

0.2 V

CHIP HANDLING

DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be

accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290

°C ± 5°C; Handling Tool:

Tweezers; Time: less than 1min.

WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil

(0.018 to 0.025 mm) gold wire. Stage temperature: 220

°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:

20 to 30 gms depending on size of wire and Bond Tip Temperature.

HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised

during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at

all stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.

Cgs

Cgd

Cds

Rg

Rd

Rdb

Ris

Rs

Id

Lg

Ld

Ls

Cbs

Rid

SCHEMATIC