NST857BF3T5G

http://onsemi.com

4

PACKAGE DIMENSIONS

SOT−1123

CASE 524AA

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

DIM MIN

MAX

MILLIMETERS

A

0.34

0.40

b

0.15

0.28

c

0.07

0.17

D

0.75

0.85

E

0.55

0.65

0.95

1.05

L

0.185 REF

D

E

c

A

−Y−

−X−

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

e

b1

0.10

0.20

STYLE 1:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

1

2

3

0.35

0.40

TOP VIEW

SIDE VIEW

3X

BOTTOM VIEW

L2

L

3X

DIMENSIONS: MILLIMETERS

1.20

2X

0.26

3X

0.34

PACKAGE

OUTLINE

b

2X

b1

e

0.08 XY

L2

0.05

0.15

0.20

0.38

1

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