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AMC1304L05-Q1 Datasheet(PDF) 7 Page - Texas Instruments |
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AMC1304L05-Q1 Datasheet(HTML) 7 Page - Texas Instruments |
7 / 39 page 7 AMC1304L05-Q1, AMC1304L25-Q1, AMC1304M05-Q1, AMC1304M25-Q1 www.ti.com SBAS799 – FEBRUARY 2017 Product Folder Links: AMC1304L05-Q1 AMC1304L25-Q1 AMC1304M05-Q1 AMC1304M25-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated 7.7 Safety-Related Certifications VDE UL Certified according to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12, DIN EN 60950-1 (VDE 0805 Teil 1): 2014-08, and DIN EN 60095 (VDE 0860): 2005-11 Recognized under UL1577 component recognition and CSA component acceptance NO 5 programs Reinforced insulation Single protection File number: 40040142 File number: E181974 (1) Input, output, or the sum of input and output power must not exceed this value. 7.8 Safety Limiting Values Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A failure of the I/O circuitry may allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IS Safety input, output, or supply current θJA = 80.2°C/W, LDOIN = 18 V, TJ = 150°C, TA = 25°C, see Figure 3 86.5 mA PS Safety input, output, or total power θJA = 80.2°C/W, TJ = 150°C, TA = 25°C, see Figure 4 1558(1) mW TS Maximum safety temperature 150 °C The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. |
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