23.00mm [0.906"]

1.00mm

[0.039"]

1.00mm

[0.039"]

0.51mm

[0.020"]

2.87mm

[0.113"]

Description: Giga-snaP BGA SMT Foot

365 position (1.0mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.

Status: Released

Drawing: S. Huang

Scale: 4:1

Rev: A

Date: 1/25/2012

Modified:

File: SF-BGA365A-B-42(F) Dwg

SF-BGA365A-B-42(F) Drawing

© 2012 IRONWOOD ELECTRONICS, INC.

Tele: (952) 229-8200

www.ironwoodelectronics.com

1

Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

FR4/G10 or equivalent high temp material. (RoHS)

2

Top View

Side View

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

3

Contacts: Beryllium Copper Alloy172, HT; Finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

Patent Pending

4

Solder Balls (See table above)

CONTACT DATA

Accepts 0.20mm - 0.33mm Diameter pins

3-finger

37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)

30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)

20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)

Ordering Information:

Solder Ball Alloy

Part Number Suffix

Sn63Pb37

*RoHS Compliant

-42

Sn96.5Ag3.0Cu0.5

-42F*

2

4

1

3

Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Detail A

Detail A

1.33mm

[0.052"]

2.36mm

[0.093"]