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MAX17572 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX17572 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 16 page VIN to PGND .........................................................-0.3V to +65V EN/UVLO to GND..................................................-0.3V to +65V EXTVCC to GND ...................................................-0.3V to +26V BST to PGND........................................................-0.3V to +70V LX to PGND................................................-0.3V to (VIN + 0.3)V BST to LX.............................................................-0.3V to +6.5V BST to VCC ...........................................................-0.3V to +65V RESET, SS, RT/SYNC to GND............................-0.3V to +6.5V PGND to GND......................................................-0.3V to +0.3V FB to GND............................................................-0.3V to +1.5V VCC to PGND.......................................................-0.3V to +6.5V LX Total RMS Current ........................................................±1.6A Continuous Power Dissipation (TA = +70°C) (derate 24.4mW/°C above +70°C) (Multilayer board) ..1951mW Output Short-Circuit Duration....................................Continuous Junction Temperature......................................................+150°C Storage Temperature Range............................ -65°C to +160°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow).......................................+260°C Junction-to-Ambient Thermal Resistance (θJA) ..............41°C/W Junction-to-Case Thermal Resistance (θJC)..................8.5°C/W (Note 1) (VIN = VEN/UVLO = 24V, RRT = 40.2k, CVCC = 2.2µF, VPGND = VGND = EXTVCC = 0, LX = SS = RESET = OPEN, VBST to VLX = 5V, VFB = 1V, TA = -40°C to 125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2) MAX17572 4.5V–60V, 1A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensaton www.maximintegrated.com Maxim Integrated │ 2 Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Junction temperature greater than +125°C degrades operating lifetimes. Package Thermal Characteristics PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY (VIN) Input Voltage Range VIN_ 4.5 60 V Input Shutdown Current IIN-SH VEN/UVLO = 0V (shutdown mode) 4.65 7.25 µA Input Quiescent Current IQ_PWM Normal switching mode, FSW = 500kHz, VFB = 0.8V, EXTVCC = GND 5.2 mA ENABLE/UVLO (EN) EN/UVLO Threshold VENR VEN/UVLO rising 1.19 1.215 1.26 V VENF VEN/UVLO falling 1.068 1.09 1.131 V EN/UVLO Input Leakage Current IENLKG VEN/UVLO = 1.25V, TA = 25°C -50 +50 nA VCC LDO VCC Output Voltage Range VCC 1mA ≤ IVCC ≤ 15mA 4.75 5 5.25 V 6V ≤ VIN ≤ 60V; IVCC = 1mA 4.75 5 5.25 V VCC Current Limit IVCC-MAX VCC = 4.3V, VIN = 6.5V 25 54 100 mA VCC Dropout VCC-DO VIN = 4.5V , IVCC = 15mA 4.15 V VCC UVLO VCC-UVR Rising 4.05 4.2 4.3 V VCC-UVF Falling 3.65 3.8 3.9 V Electrical Characteristics |
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