© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

T2073_T591_T598 • 9/16/2016 11

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T591/T598 High Humidity/High Temperature Automotive Grade Polymer Electrolytic, 2.5 – 50 VDC

Soldering Process

KEMET’sfamiliesofsurfacemountcapacitorsare

compatiblewithwave(singleordual),convection,IR,

orvaporphasereflowtechniques.Preheatingofthese

componentsisrecommendedtoavoidextremethermal

stress.KEMET'srecommendedprofileconditionsfor

convectionandIRreflowreflecttheprofileconditionsofthe

IPC/J–STD–020Dstandardformoisturesensitivitytesting.

Thedevicescansafelywithstandamaximumofthreereflow

passesattheseconditions.

PleasenotethatalthoughtheX/7343–43casesizecan

withstandwavesoldering,thetallprofile(4.3mmmaximum)

dictatescareinwaveprocessdevelopment.

Handsolderingshouldbeperformedwithcareduetothe

difficultyinprocesscontrol.Ifperformed,careshouldbe

takentoavoidcontactofthesolderingirontothemolded

case.Theironshouldbeusedtoheatthesolderpad,

applyingsolderbetweenthepadandthetermination,until

reflowoccurs.Oncereflowoccurs,theironshouldbe

removedimmediately.“Wiping”theedgesofachipand

heatingthetopsurfaceisnotrecommended.

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Minimum (T

100°C

150°C

Temperature Maximum (T

150°C

200°C

Time (t

60–120seconds

60–120seconds

Ramp-up Rate (T

3°C/secondsmaximum 3°C/secondsmaximum

LiquidousTemperature(T

183°C

217°C

TimeAboveLiquidous(t

60–150seconds

60–150seconds

Peak Temperature (T

220°C*

235°C**

250°C*

260°C**

Timewithin5°CofMaximum

Peak Temperature (t

20secondsmaximum

30secondsmaximum

Ramp-downRate(T

6°C/secondsmaximum 6°C/secondsmaximum

Time25°CtoPeak

Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Storage

AllKO-CapSeriesareshippedinmoisturebarrierbags(MBBs)withdesiccantand humidityindicatorcard(HIC).

Thesepartsareclassified asMSL3(MoistureSensitivityLevel3)perIPC/JEDECJ-STD-020andpackagedper

IPC/JEDECJ–STD–033

MSL3specifiesafloortimeof168Hat30ºCmaximumtemperature and60%relativehumidity

UnusedcapacitorsshouldbesealedinaMBBwithfreshdesiccant.

Calculatedshelflifeinsealedbag:

–12monthsfrombagsealdateinastorageenvironmentof<40ºCandhumidity<90%RH

–24monthsfrombagsealdateinastorageenvironmentof<30ºCandhumidity<70%RH 

Ifbakingisrequired,refertoIPC/JEDECJ–STD–033forbakeprocedure

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak