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LMC6041IM Datasheet(PDF) 8 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LMC6041IM
Description  CMOS Single Micropower Operational Amplifier
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LMC6041IM Datasheet(HTML) 8 Page - National Semiconductor (TI)

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Applications Hints (Continued)
In the circuit of
Figure 2, R1 and C1 serve to counteract the
loss of phase margin by feeding the high frequency compo-
nent of the output signal back to the amplifier’s inverting in-
put, thereby preserving phase margin in the overall feedback
loop.
Capacitive load driving capability is enhanced by using a pull
up resistor to V
+ (Figure 3 ). Typically a pull up resistor con-
ducting 10 µA or more will significantly improve capacitive
load responses. The value of the pull up resistor must be de-
termined based on the current sinking capability of the ampli-
fier with respect to the desired output swing. Open loop gain
of the amplifier can also be affected by the pull up resistor
(see Electrical Characteristics).
PRINTED-CIRCUIT-BOARD LAYOUT
FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate
with less than 1000 pA of leakage current requires special
layout of the PC board. When one wishes to take advantage
of the ultra-low bias current of the LMC6041, typically less
than 2fA, it is essential to have an excellent layout. Fortu-
nately, the techniques of obtaining low leakages are quite
simple. First, the user must not ignore the surface leakage of
the PC board, even though it may sometimes appear accept-
ably low, because under conditions of high humidity or dust
or contamination, the surface leakage will be appreciable.
To minimize the effect of any surface leakage, lay out a ring
of foil completely surrounding the LMC6041’s inputs and the
terminals of capacitors, diodes, conductors, resistors, relay
terminals, etc. connected to the op-amp’s inputs, as in
Fig-
ure 4. To have a significant effect, guard rings should be
placed on both the top and bottom of the PC board. This PC
foil must then be connected to a voltage which is at the same
voltage as the amplifer inputs, since no leakage current can
flow between two points at the same potential. For example,
a PC board trace-to-pad resistance of 10
12
Ω, which is nor-
mally considered a very large resistance, could leak 5 pA if
the trace were a 5V bus adjacent to the pad of the input. This
would cause a 100 times degradation from the LMC6041’s
actual performance. However, if a guard ring is held within 5
mV of the inputs, then even a resistance of 10
11
Ω would
cause only 0.05 pA of leakage current. See
Figure 5 for typi-
cal connections of guard rings for standard op-amp
configurations.
DS011136-6
FIGURE 2. LMC6041 Noninverting Gain of 10 Amplifier,
Compensated to Handle Capacitive Loads
DS011136-18
FIGURE 3. Compensating for Large
Capacitive Loads with a Pull Up Resistor
DS011136-7
FIGURE 4. Example of Guard Ring
in P.C. Board Layout
www.national.com
8


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