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FM0H223ZFL118 Datasheet(PDF) 11 Page - Kemet Corporation |
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FM0H223ZFL118 Datasheet(HTML) 11 Page - Kemet Corporation |
11 / 18 page 11 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com S6012_FM • 10/5/2016 Supercapacitors – FM Series Ammo Pack Taping Format (FMC0H334ZFTP) + – + – P2 b P1 F W4 P0 D0 c t3 t2 t1 ∆h P Ammo Pack Taping Specifications (FMC0H334ZFTP) Item Symbol Dimensions (mm) Component Height a 15.0±0.5 Component Width b 14.0±0.5 Component Thickness c 9.0±0.5 Lead-Wire Width W 4 0.6±0.1 Lead-Wire Thickness t 3 0.6±0.1 Component Pitch P 25.4±1.0 Sprocket Hole Pitch P 0 12.7±0.3 Sprocket Hole Center to Lead Center P 1 3.85±0.7 Sprocket Hole Center to Component Center P 2 6.35±0.7 Lead Spacing F 5.0±0.5 ComponentAlignment(side/side) ∆h 2.0 Maximum Carrier Tape Width W 18.0+1.0/−0.5 Hold-Down Tape Width W 0 12.5 Minimum Sprocket Hole Position W 1 9.0±0.5 Hold-Down Tape Position W 2 3.0 Maximum HeighttoSeatingPlane(leadlength) H 16.0±0.5/18.0±0.5 Sprocket Hole Diameter D 0 ø4.0±0.2 Carrier Tape Thickness t 1 0.67±0.2 TotalThickness(CarrierTape,Hold-DownTapeand Lead) t 2 1.7Maximum Cut Out Length L 11.0 Maximum |
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