MMU 0102 HF, MMA 0204 HF, MMB 0207 HF

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Vishay Beyschlag

Revision: 26-Oct-15

8

Document Number: 28718

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

4.13

-

Short time overload;

standard operation mode

U = 2.5 x

;

5 s

± (0.1 % R + 0.01

)

Short time overload;

power operation mode

U = 2.5 x

;

5 s

± (0.1 % R + 0.01

)

4.40

-

Electrostatic discharge

(human body model)

3 pos. + 3 neg. discharges

MMU 0102 HF: 800 V

MMA 0204 HF: 1000 V

MMB 0207 HF: 2000 V

± (0.5 % R + 50 m

)

4.29

45 (XA)

Component solvent resistance

Isopropyl alcohol;

50 °C; method 2

No visible damage

4.30

45 (XA)

Solvent resistance of marking

Isopropyl alcohol; 50 °C;

method 1, toothbrush

Marking legible; no visible damage

4.17

58 (Td)

Solderability

Solder bath method; SnPb40;

non-activated flux;

(215 ± 3) °C; (3 ± 0.3) s

Good tinning (

 95 % covered);

no visible damage

Solder bath method; SnAg3Cu0.5 or

SnAg3.5; non-activated flux;

(235 ± 3) °C; (2 ± 0.2) s

Good tinning (

 95 % covered);

no visible damage

4.18

58 (Td)

Resistance to soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

± (0.5 % R + 0.05

)

4.32

Shear (adhesion)

45 N

No visible damage

4.35

-

Flammability

needle flame test; 10 s

No burning after 30 s

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

IEC

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (

R)

Stability for product types:

MMU 0102 HF

6.8

 to 470 

MMA 0204 HF

1.5

 to 475 

MMB 0207 HF

6.8

 to 470 

P

P