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SiC531A Datasheet(PDF) 11 Page - Vishay Siliconix

Part # SiC531A
Description  30 A VRPower Integrated Power Stage
Download  17 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SiC531A Datasheet(HTML) 11 Page - Vishay Siliconix

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SiC531, SiC531A
www.vishay.com
Vishay Siliconix
S15-2799-Rev. A, 30-Nov-15
11
Document Number: 65999
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Step 5: Signal Routing
1. Route the PWM and ZCD_EN# signal traces out of the
top left corner next to pin 1.
2. The PWM signal is an important signal, both signal and
return traces should not cross any power nodes on any
layer.
3. It is best to “shield” these traces from power switching
nodes, e.g. VSWH, with a GND island to improve signal
integrity.
4. GL (pin 19) has been connected with GL pad (pin 24)
internally.
Step 6: Adding Thermal Relief Vias
1. Thermal relief vias can be added on the VIN and AGND
pads to utilize inner layers for high-current and thermal
dissipation.
2. To achieve better thermal performance, additional vias
can be placed on VIN plane and PGND plane.
3. VSWH pad is a noise source, it is not recommended to
place vias on this pad.
4. 8 mil vias for pads and 10 mils vias for planes are the
optimal via sizes. Vias on pad may drain solder during
assembly and cause assembly issues. Consult with the
assembly house for guidelines.
Step 7: Ground Connection
1. It is recommended to make a single connection between
AGND and PGND which can be made on the top layer.
2. It is recommended to make the entire first inner layer
(below top layer) the ground plane and separate them
into AGND and PGND planes.
3. These ground planes provide shielding between noise
sources on top layer and signal traces on bottom layer.
PGND
AGND
AGND
VIN Plane
PGND Plane
VSWH
PGND
VIN
AGND
VSWH
PGND
AGND


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