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SiC531A Datasheet(PDF) 11 Page - Vishay Siliconix |
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SiC531A Datasheet(HTML) 11 Page - Vishay Siliconix |
11 / 17 page SiC531, SiC531A www.vishay.com Vishay Siliconix S15-2799-Rev. A, 30-Nov-15 11 Document Number: 65999 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Step 5: Signal Routing 1. Route the PWM and ZCD_EN# signal traces out of the top left corner next to pin 1. 2. The PWM signal is an important signal, both signal and return traces should not cross any power nodes on any layer. 3. It is best to “shield” these traces from power switching nodes, e.g. VSWH, with a GND island to improve signal integrity. 4. GL (pin 19) has been connected with GL pad (pin 24) internally. Step 6: Adding Thermal Relief Vias 1. Thermal relief vias can be added on the VIN and AGND pads to utilize inner layers for high-current and thermal dissipation. 2. To achieve better thermal performance, additional vias can be placed on VIN plane and PGND plane. 3. VSWH pad is a noise source, it is not recommended to place vias on this pad. 4. 8 mil vias for pads and 10 mils vias for planes are the optimal via sizes. Vias on pad may drain solder during assembly and cause assembly issues. Consult with the assembly house for guidelines. Step 7: Ground Connection 1. It is recommended to make a single connection between AGND and PGND which can be made on the top layer. 2. It is recommended to make the entire first inner layer (below top layer) the ground plane and separate them into AGND and PGND planes. 3. These ground planes provide shielding between noise sources on top layer and signal traces on bottom layer. PGND AGND AGND VIN Plane PGND Plane VSWH PGND VIN AGND VSWH PGND AGND |
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