VEML6070

www.vishay.com

Vishay Semiconductors

Rev. 1.7, 05-Dec-16

11

Document Number: 84277

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 14 - VEML6070 A3OP Solder Reflow Profile Chart

RECOMMENDED IRON TIP SOLDERING CONDITION AND WARNING HANDLING

1. Solder the device with the following conditions:

1.1. Soldering temperature: 400 °C (max.)

1.2. Soldering time: 3 s (max.)

2. If the temperature of the method portion rises in addition to the residual stress between the leads, the possibility that an

open or short circuit occurs due to the deformation or destruction of the resin increases.

3. The following methods: VPS and wave soldering, have not been suggested for the component assembly.

4. Cleaning method conditions:

4.1. Solvent: methyl alcohol, ethyl alcohol, isopropyl alcohol

4.2. Solvent temperature < 45 °C (max.)

4.3. Time: 3 min (min.)

200

150

217

255

Time (s)

Max. Temperature

(260 °C + 5 °C / - 5 °C)/10 s

Ramp-Down Rate

6 °C/s (max.)

Ramp-Up Rate

3 °C/s (max.)

Soldering Zone

60 s to 150 s

Ramp-Up Rate

3 °C/s (max.)

Pre-Heating Time

t