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SY58020UMI Datasheet(PDF) 9 Page - Micrel Semiconductor |
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SY58020UMI Datasheet(HTML) 9 Page - Micrel Semiconductor |
9 / 9 page 9 Precision Edge™ SY58020U Micrel MICREL, INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB http://www.micrel.com The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2003 Micrel, Incorporated. 16 LEAD MicroLeadFrame™ (MLF-16) Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heavy Copper Plane Heavy Copper Plane VEE VEE Heat Dissipation PCB Thermal Consideration for 16-Pin MLF™ Package (Always solder, or equivalent, the exposed pad to the PCB) 3.00BSC 2.75BSC 0.50 DIA 3.00BSC 12 ° max SEATING PLANE 2.75BSC 16 1 1 2 3 4 N 2 3 4 0.85 +0.15 –0.65 0.65 +0.15 –0.65 0.01 +0.04 –0.01 0.23 +0.07 –0.05 0.01 +0.04 –0.01 0.42 +0.18 –0.18 0.42 +0.18 –0.18 0.23 +0.07 –0.05 1.60 +0.10 –0.10 PIN 1 ID 0.5 BSC 1.5 REF 0.42 +0.18 –0.18 1.60 +0.10 –0.10 0.40 +0.05 –0.05 0.20 REF. 0.5BSC SECTION "C-C" SCALE: NONE TOP VIEW BOTTOM VIEW 1. DIMENSIONS ARE IN mm. 2. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. 3. PACKAGE WARPAGE MAX 0.05mm. 4. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS CC CL 4 Rev. 02 Package Notes: Note 1. Package meets Level 2 qualification. Note 2. All parts are dry-packaged before shipment. Note 3. Exposed pads must be soldered to a ground for proper thermal management. |
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