© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

C1020_X7R_KPS_SMD • 8/11/2016

99

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, X7R Dielectric, 10 – 250 VDC (Commercial Grade)

Table 3 – KPS Land Pattern Design Recommendations (mm)

EIA SIZE

CODE

METRIC

SIZE

CODE

Median (Nominal) Land

Protrusion

C

Y

X

V1

V2

1210

3225

1.50

1.14

1.75

5.05

3.40

1812

4532

2.20

1.35

2.87

6.70

4.50

2220

5650

2.69

2.08

4.78

7.70

6.00

Image at right based on an EIA 1210 case size.

Soldering Process

KEMET’s KPS Series devices are compatible with IR

reflow techniques. Preheating of these components is

recommended to avoid extreme thermal stress. KEMET's

recommended profile conditions for IR reflow reflect the

profile conditions of the IPC/J–STD–020D standard for

moisture sensitivity testing.

To prevent degradation of temperature cycling capability,

care must be taken to prevent solder from flowing into

the inner side of the lead frames (inner side of "J" lead in

contact with the circuit board).

After soldering, the capacitors should be air cooled to

room temperature before further processing. Forced air

cooling is not recommended.

Hand soldering should be performed with care due to the

difficulty in process control. If performed, care should be

taken to avoid contact of the soldering iron to the capacitor

body. The iron should be used to heat the solder pad,

applying solder between the pad and the lead, until reflow

occurs. Once reflow occurs, the iron should be removed

immediately. (Preheating is required when hand soldering to

avoid thermal shock.)

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Minimum (T

100°C

150°C

Temperature Maximum (T

150°C

200°C

Time (t

60 – 120 seconds

60 – 120 seconds

Ramp-up Rate (T

3°C/seconds maximum 3°C/seconds maximum

Liquidous Temperature (T

183°C

217°C

Time Above Liquidous (t

60 – 150 seconds

60 – 150 seconds

Peak Temperature (T

235°C

250°C

Time within 5°C of Maximum

Peak Temperature (t

20 seconds maximum

10 seconds maximum

Ramp-down Rate (T

6°C/seconds maximum 6°C/seconds maximum

Time 25°C to Peak

Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak

Y

C

C

X

X

V2

Grid Placement Courtyard

Y

V1