V8PAL50-M3

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Vishay General Semiconductor

Revision: 20-Oct-16

3

Document Number: 87912

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 3 - Typical Instantaneous Forward Characteristics

Fig. 4 - Typcial Reverse Leakage Characteristics

Fig. 5 - Typical Junction Capacitance

Fig. 6 - Typcial Transient Thermal Impedance

Fig. 7 - Thermal Resistance Junction to Ambient vs.

Copper Pad Areas

0.1

1

10

100

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

Instantaneous Forward Voltage (V)

0.001

0.01

0.1

1

10

100

10

20

30

40

50

60

70

80

90

100

Percent of Rated Peak Reverse Voltage (%)

T

T

T

T

100

1000

10 000

0.1

1

10

100

Reverse Voltage (V)

T

f = 1.0 MHz

V

-p

1

10

100

1000

0.01

0.1

1

10

100

t -Pulse Duration (s)

Junction to Ambient

70

80

90

100

110

20

30

40

50

60

70

80

0123

456789

20

0123

456789

S (cm

Epoxy printed circiut

board FR4 copper

thickness = 70 μm