2

5

3

8

1

10

13

4

7

11

9

6

12

Ground Pad Contacts:

9 x 15 Array with 1mm pitch

SMP/SM Interposer Detail

SCALE 4:1

ITEM #

DESCRIPTION

Material

1

Socket Base 13x20mm IC

7075-T6 Aluminum Alloy

2

Compression Screw M10

7075-T6 Alumium Alloy

3

Compression Plate 13x20mm IC

7075-T6 Aluminum Alloy

4

Backing Plate with 4 post and rectangular center pad

for 13x20mm chip

7075-T6 Alumium Alloy

5

Socket Lid Swivel 13x20mm IC

7075-T6 Aluminum Alloy

6

Customer's IC 13x19mm, 0.7/0.8mm pitch QFN78

FR4 High temp

7

Dowel Pin, 1/32" x 3/16", SS

Chrome Stainless Steel

8

#0-80 x 0.5, SH Cap Screw

Alloy Steel

9

#0-80 Shoulder Screw, 2.29mm thread length

Stainless Steel (303)

10

Customer's target PCB

FR4 High temp

11

SMP IC Guide for 13x19mm IC

Torlon 4203

12

SMP protective layer for 13x19mm 0.7/0.8mm QFN78

SMP

13

SMP SM interposer for 13x19mm 0.7/0.8mm QFN78

SM elastomer

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Skt Det

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 12/7/2015

Material: N/A

Finish: N/A

Weight: 18.10

SMP-QFN-8011 Drawing

SCALE: 3:1

SHEET: 6 OF 6

ENG: S. Huang

FILE: SMP-QFN-8011 Dwg

DRAWN BY: M. Raske